-
ABOUT
- 회사소개
- CEO’s message
- History
- Vision
- C.I
- PRODUCT
- R&D
-
TECHNICAL
- TECHNICAL
- Laser Technology
- SUPPORT
-
CONTACT US
- CONTACT US
- CONTACT US
ENG
KOR
CHN
JPN
- PRODUCT
PRODUCT
- Solder Ball Attach
- Marking System
- Laser Drilling
- PKG Stack System
- Package Laser Saw System
- Flux Pre-Cleaning System
- Substrate Merge & Sorting System
- Loader & Offloader System
- Router System
- Solder Ball Attach Tool Kit
- Pick & Place System
- Other Equipment
- Display
Solder Ball Attach
K-1
| File | Download |
|---|
- System Specification
| Item | Model | K1 |
|---|---|---|
| Major Functional Capability | For BGA Strip | |
| Strip / Boat size | Length: 180 ~ 250mm / Width: 30 ~ 100mm | |
| Ball Size | 0.25 ~ 0.76mm | |
| Ball Pitch | 0.50 ~ 1.27mm | |
| Ball Ejecting | Free Fall(Gravity) or Ejector Pin Pushing | |
| Placement Area | Anysize O.K | |
| Magazine Loadings | 3 ~ 5 ea | |
| System | Strip/Boat index | Dual Shuttle(Front/Rear) |
| Position alignment | PRS(Patten Recognition System) Vision Alignment | |
| Index moving motion control | Ball Screw | |
| Tool loading motion control | Motor control | |
| Productivity | MTBF | 168hrs |
| 1st Pass Yield | 99.98% | |
| Converson time | 15minutes | |
| Cycle time(SPM, BPM) | 1up 1tep: 12sec (0.3mm Ball size, 30,000I/O) |
