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- PRODUCT
PRODUCT
- Solder Ball Attach
- Marking System
- Laser Drilling
- PKG Stack System
- Package Laser Saw System
- Flux Pre-Cleaning System
- Substrate Merge & Sorting System
- Loader & Offloader System
- Router System
- Solder Ball Attach Tool Kit
- Pick & Place System
- Other Equipment
- Display
Solder Ball Attach
K-2
| File | Download |
|---|
- System Specification
| Item | Model | K2 |
|---|---|---|
| Major Functional Capability | For BGA Strip | |
| Strip / Boat size | Length: 180 ~ 250mm / Width: 30 ~ 100mm | |
| Ball Size | 0.15 ~ 0.76mm | |
| Ball Pitch | 0.30 ~ 1.27mm | |
| Ball Ejecting | Free Fall(Gravity) or Ejector pin pushing | |
| Placement Area | Anysize O.K | |
| Magazine Loadings | 3 ~ 5 ea | |
| System | Strip/Boat index | Dual Shuttle(Front/Rear) |
| Position alignment | PRS(Patten Recognition System) Vision Alignment | |
| Index moving motion control | Motor control | |
| Tool loading motion control | Motor control | |
| Productivity | MTBF | 168hrs |
| 1st Pass Yield | 99.98% | |
| Converson time | 15minutes | |
| Cycle time(SPM, BPM) | 1up 2tep: 22sec (0.25mm Ball size, 30,000I/O) |
