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- PRODUCT
PRODUCT
- Solder Ball Attach
- Marking System
- Laser Drilling
- PKG Stack System
- Package Laser Saw System
- Flux Pre-Cleaning System
- Substrate Merge & Sorting System
- Loader & Offloader System
- Router System
- Solder Ball Attach Tool Kit
- Pick & Place System
- Other Equipment
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Pick & Place System
KPUM3000(Boat to Tray) / KPP400(Tray to Boat)
| File | Download |
|---|
- System Specification
| Item | Description |
|---|---|
| Boat Size | 322.6mm x 135.9mm , 322.6mm x 160mm |
| Tray Type | JEDEC, EIAJ, TOSHIBA, ELPIDA |
| Package Size | Min. 6x6 ~ Max. 15x15 |
| Wafer Size | 8 ~ 12 inch |
| Conversion Time | 5mins |
| Loading | Encoder-typed precision position control |
| Height Check | Laser Height Sensor |
| MTBA | 1 hr |
| 1st Pass Yield | 99.98% |
| MTBF | 144 hrs |
