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Solder Ball Attach

Solder Ball Attach K-2
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  • System Specification
Item Model K2
Major Functional Capability For BGA Strip
Strip / Boat size Length: 180 ~ 250mm / Width: 30 ~ 100mm
Ball Size 0.15 ~ 0.76mm
Ball Pitch 0.30 ~ 1.27mm
Ball Ejecting Free Fall(Gravity) or Ejector pin pushing
Placement Area Anysize O.K
Magazine Loadings 3 ~ 5 ea
System Strip/Boat index Dual Shuttle(Front/Rear)
Position alignment PRS(Patten Recognition System) Vision Alignment
Index moving motion control Motor control
Tool loading motion control Motor control
Productivity MTBF 168hrs
1st Pass Yield 99.98%
Converson time 15minutes
Cycle time(SPM, BPM) 1up 2tep: 22sec (0.25mm Ball size, 30,000I/O)
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