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- PRODUCT
- Solder Ball Attach
Solder Ball Attach
- Solder Ball Attach
- Marking System
- Laser Drilling
- PKG Stack System
- Package Laser Saw System
- Flux Pre-Cleaning System
- Substrate Merge & Sorting System
- Loader & Offloader System
- Router System
- Solder Ball Attach Tool Kit
- Pick & Place System
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Solder Ball Attach
KWA970
| 파일명 | Download |
|---|
- System Specification
| Item | Description |
|---|---|
| Ball Size | 0.10 ~ 0.76mm |
| Ball Pitch | 0.20 ~ 1.27mm |
| Application | Wafer(SEMI / LED..), COG, etc. |
| Wafer Size | 8 ~ 12 inch |
| Cycle Time | 120sec / wafer |
| Flux | Material Mask Printing |
| Ball Drop | Drop and Air Ejecting |
| MTBA | 1 hr |
| 1st Pass Yield | 99.98% |
| MTBF | 144 hrs |
| Uptime | 99% |
| Placement Accuracy | +/- 25um |
