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Solder Ball Attach

Solder Ball Attach KWA970
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  • System Specification
Item Description
Ball Size 0.10 ~ 0.76mm
Ball Pitch 0.20 ~ 1.27mm
Application Wafer(SEMI / LED..), COG, etc.
Wafer Size 8 ~ 12 inch
Cycle Time 120sec / wafer
Flux Material Mask Printing
Ball Drop Drop and Air Ejecting
MTBA 1 hr
1st Pass Yield 99.98%
MTBF 144 hrs
Uptime 99%
Placement Accuracy +/- 25um
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