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- PRODUCT
- Package Laser Saw System
Package Laser Saw System
- Solder Ball Attach
- Marking System
- Laser Drilling
- PKG Stack System
- Package Laser Saw System
- Flux Pre-Cleaning System
- Substrate Merge & Sorting System
- Loader & Offloader System
- Router System
- Solder Ball Attach Tool Kit
- Pick & Place System
- Other Equipment
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Package Laser Saw System
KLCM3000
| 파일명 | Download |
|---|
- System Specification
| Item | Description | ||
|---|---|---|---|
| Laser | Number of beam | 1Beam/1Source (Multi beam: Optional) | |
| Source(TBD) | Green(532nm), UV(355nm), IR source(1064nm), Co2(9.4, 10.6um) | ||
| Beam mode(TBD) | Focusing head / Scan field 70x70mm | ||
| Laser Position Accuracy | ±30um | ||
| System | Working Area [mm] | 300x300mm | |
| X,Y Accuracy | ±15um | ||
| Vision (Optional) | PRS Vision alignment | ||
| Dust | Dust collect suction system | ||
| Set-up | CAD file reading(other drawing formats are Optional) | ||
| Loading/Unloading | Manual loading (※Auto loading/unloading are Optional) | ||
| Foot print | 1,600 x 1,400 x 1,700mm | ||
| Weight | 1,000Kg | ||
